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Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Specifications
Brand Name :
WINNER
Model Number :
PW-12
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
Payment Terms :
L/C,Western Union,T/T Supply Ability
Supply Ability :
100000 rolls per month
Delivery Time :
5-8 WORKING DAYS
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Coating Thickness :
5 microns
Temperature Range :
-40°C to 150°C
Availability :
Custom sizes available
Conductivity :
98%
Electricalconductivity :
Excellent
Compliancestandards :
RoHS, REACH
Color :
Silver
Tensile Strength :
High
Purity :
99.9% Copper
Surfacefinish :
Smooth, shiny palladium layer
Package Size :
100 meters
Tensilestrength :
High
Operatingtemperaturerange :
-40°C to 150°C
Coatingmaterial :
Palladium
Surface Finish :
Smooth, shiny palladium layer
Coating Material :
Palladium
Description
Ultra Fine Palladium Coated Copper Wire 15um 20um 25um Bonding Wire for Chip Packaging
Product Overview

Ultra fine Pd coated copper bonding wire designed for advanced chip packaging with fine pitch and high-density interconnections.

  • Available in 15μm, 20μm, and 25μm diameters
  • Palladium coating for enhanced performance
  • Ideal for fine pitch applications
  • Optimized for high-density interconnections
  • Advanced chip packaging solutions


Company Information
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
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Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

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Product Detail
Brand Name :
WINNER
Model Number :
PW-12
Certification :
ISO9100
Place of Origin :
CHINA
MOQ :
1PC
Price :
999
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Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections
Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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