Manufacturing Process of Gold Plated Tungsten Wire
The production of gold plated tungsten wire involves precision wire drawing, surface cleaning, and controlled gold electroplating or cladding. Advanced process control ensures uniform gold thickness, strong adhesion, and minimal surface defects.
High-purity raw materials and strict quality inspection are essential to meet semiconductor-grade standards.
Product Specifications
| Material |
Tungsten |
| Purity |
Wu≥ 99.99% |
| Gold-plated thickness |
0.3um |
| Wire diameter |
0.02mm/0.03mm/0.04mm/0.05mm/0.06mm/0.07mm/0.1mm/0.2mm |
| Length |
1000/2000 meter (cut from roll) |
|
Gold plated tungsten wire properties (Theoretical)
|
|
Compound Formula
|
W
|
|
Molecular Weight
|
183.84
|
|
Appearance
|
Metallic wire
|
|
Melting Point
|
3410 °C
|
|
Boiling Point
|
5660 °C
|
|
Density
|
19.3 g/cm3 (25 °C)
|
|
Solubility in H2O
|
N/A
|
|
Electrical Resistivity
|
4.9 μΩ-cm, (20 °C)
|
|
Exact Mass
|
183.951 g/mol
|
|
Monoisotopic Mass
|
183.951 g/mol
|
Key Features
- Shiny golden surface condition - brighter than black or white tungsten wire
- Exceptional high temperature resistance and high melting point
- Low coefficient of thermal expansion
- Superior corrosion resistance compared to ordinary tungsten wire
Applications
Gold-plated tungsten wire serves as an electrode in photocopiers, replacing corrosion-resistant tungsten wire and tungsten aluminum wire. It also functions as an ideal corrosion-resistant electron emission material with applications in high-energy physics, meteorology, and other scientific research fields.
Product Images