MachineU > China Products > Textile & Leather Product > Yarn > Metallic Yarn
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Specifications
Certification :
ISO9100
Diameter :
0.7-1.0mil
Supply Ability :
9999999
Certifications :
ISO 9001
Product Type :
Bonding Wire
Payment Terms :
T/T,D/A,Western Union
Corrosion Resistance :
High
Delivery Time :
5-8 days
Bond Strength :
High
Place of Origin :
China
Price :
999
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Surface Finish :
Smooth, Matte, Textured
Elongation :
3-20%
Purity :
99.99%
Coating :
Gold
Brand Name :
WINNER
Material :
Gold, Silver
MOQ :
1000m
Description
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra-thin 0.003mm gold plated silver wire, gold coating prevents silver oxidation, stable signal transmission for tiny MEMS chip internal wiring.
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Send your message to this supplier
Send Now

Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection

Ask Latest Price
Watch Video
Product Detail
Certification :
ISO9100
Diameter :
0.7-1.0mil
Supply Ability :
9999999
Certifications :
ISO 9001
Product Type :
Bonding Wire
Payment Terms :
T/T,D/A,Western Union
Contact Supplier
video
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection
Ultra Fine Gold Plated Silver Bonding Wire Anti-Tarnish MEMS Micro Chip Interconnection

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Gold Plated Silver Wire
MachineU China Products Textile & Leather Product Yarn Metallic Yarn
Contact Supplier
Submit Requirement