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0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Specifications
Model Number :
PW-12
Availability :
Custom sizes available
MOQ :
1PC
Delivery Time :
5-8 WORKING DAYS
Corrosion Resistance :
High
Payment Terms :
L/C,Western Union,T/T Supply Ability
Coating :
Au, Palladium
Surface Finish :
Bright
Package Size :
100 meters
Place of Origin :
CHINA
Bond Strength :
High
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Price :
999
Material :
copper
Supply Ability :
100000 rolls per month
Product Type :
Bonding Wire
Package :
Spool
Certification :
ISO9100
Brand Name :
WINNER
Length Meters :
500/1000
Description
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Ultra-fine 0.015mm Pd coated copper wire with compact palladium layer, stops copper oxidation, perfect for miniaturized CSP advanced chip packaging.

  • Superior cost-effectiveness compared to gold bonding wire
  • Excellent performance in semiconductor packaging applications
  • Widely accepted and implemented across the industry
  • Maintains reliability and bonding quality standards

0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire 0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire 0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire 0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
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0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire

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Product Detail
Model Number :
PW-12
Availability :
Custom sizes available
MOQ :
1PC
Delivery Time :
5-8 WORKING DAYS
Corrosion Resistance :
High
Payment Terms :
L/C,Western Union,T/T Supply Ability
Contact Supplier
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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