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0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
Specifications
Model Number :
BC010
Material :
Copper
MOQ :
1PC
Delivery Time :
5-8 WORKING DAYS
Coating Thickness :
customized
Payment Terms :
L/C,Western Union,T/T Supply Ability
Package :
Spool
Wire Diameter :
customized
Place of Origin :
CHINA
Packaging Details :
Roll, Neutrial Packing or with OEM LOGO
Price :
999
Purity :
99.999%
Supply Ability :
100000 rolls per month
Application :
Wire bonding
Length :
100 meters/customized
Certification :
ISO9100
Brand Name :
WINNER
Coating :
berryllium
Description
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

Ultra-thin 0.01mm BeCu wire with excellent rebound performance, tight dimensional tolerance, specially for tiny semiconductor wafer test micro probes.

Electrical
Specific Resistivity 7.68 µOhm·cm²/cm
Commercial Resistance Tolerance (On Sizes below 0.020) 3.00 %
Thermal Electromotive Force (EMF) Vs Copper -0.014
Specific Resistance 46.200 Ohm·cm/ft
Temperature Coefficient of Resistance (0 to 100 Degree Celsius (ºC) Temperature) 0.0015 Ohm/Ohm/ºC
Physical
Density 8.25 g/cm³
Youngs Modulus 18 x 106 psi
Specific Heat at 20 Degree Celsius (ºC) Temperature 0.100 cal/g
Thermal Conductivity 1.069000 W/cm/ºC
Coefficient of Linear Expansion 17.6 x 10-6 in/in ºC
Melting Point 865.00 ºC

0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

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0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

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Product Detail
Model Number :
BC010
Material :
Copper
MOQ :
1PC
Delivery Time :
5-8 WORKING DAYS
Coating Thickness :
customized
Payment Terms :
L/C,Western Union,T/T Supply Ability
Contact Supplier
video
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire
0.01mm C17200 Ultra Fine Beryllium Copper Wire High Elasticity Semiconductor Wafer Test Probe Wire

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Verified Supplier
2 Years
shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Trading Company, Seller
Main Products :
Bonding Wire, Gold Plated Tungsten Wire, Gold Plated Copper Wire
Total Annual :
1000000-10000000
Employee Number :
170~200
Certification Level :
Verified Supplier
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