| Parameter | Description |
|---|---|
| Cleanliness | General And Clean Room Use Optional |
| Property | ESD Or Non-ESD |
| Capacity | 10~25PCS(Depends On Chip Thickness) |
| Shape | Round |
| Material | Natural Or Conductive PP |
| Product Name | Wafer Jars |
| Depth | 22.86~76.2mm |
| Method | Directly Open The Lid |
| Advantage | Reduce Wafer Friction |
| Color | Black,Clear,White Lid |
| Light-weight | Yes |
| Multi-buffering | Yes |
| PP Material | Yes |
Equipment Maintenance and Replacement: During equipment maintenance or replacement, safely transport spare or repair wafer.