MachineU > China Products > Machinery > Electronic Products Machinery
High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules
High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules
Specifications
Production Cycle :
3s-12s
Chip Size :
0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
PR System :
256 grayscale levels / edge detection
Resolution :
1920pixel×2560pixel
Weight :
1200KG (Subject to actual product)
Standard Track Width :
40-90mm
Brand Name :
UW
Certification :
CE ISO
MOQ :
1set
Price :
Negotiation
Packaging Details :
carton box/wooden box
Payment Terms :
T/T
Description

Equipment Applications

Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc.

Highlights

  • High-Precision Assembly: Equipped with SP-grade silent linear guides with a straightness tolerance of within 2 μm (measured by dial indicator). Adopts system laser interferometer motion compensation technology, featuring a positioning accuracy of ±0.8 μm and a repeat positioning accuracy of ±0.4 μm. Capable of achieving fast and high-precision fixed-duration control of 6 pulses within 100 ms, ensuring consistent precision across batch-produced equipment and minimizing accuracy deviations caused by moving components.
  • Reduced Misjudgment: The nozzle is configured with an independent micro-flow air circuit, enabling separate detection of each nozzle loop to reduce system misjudgment.
  • Strong Compatibility: Compatible with both optical chip and electrical chip mounting processes.
  • Professional Services: Supported by a dedicated vision technology team, which can customize efficient and accurate positioning solutions for various product types.
  • Customization Services: A eutectic module can be added to upgrade the equipment into a eutectic die bonder.
Technical Parameters
Parameter Name
Parameter Value
Production Cycle
3s-12s
Mounting Accuracy
±3 ~ ±5μm@3σ
Angular Accuracy
±0.5° @3σ
Chip Size
0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
Chip Thickness
0.076-1mm(3-40mil, standard)minimum thickness down to 0.05mm(2mil,optional)
Substrate Size
L: 100-300mm；W: 40-90mm(Customization optional for widths below 40 mm)
H: 0.1-0.8mm(standard)0.8-2.0mm(optional)
Magazine Size
(To be provided by the customer according to product specifications)
Wafer Size
Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs)
Automatic θ Calibration
Range of ±15°
Maximum Wafer Angle Correction
360°
Bonding Force
20-300g
Standard Track Width
40-90mm
PR System
256 grayscale levels / edge detection
Resolution
1920pixel×2560pixel
PR Accuracy
5M(1920×2560pixel) FOV(16mm；×1,×2,×4)
Angular Tolerance
±0.1°
Dimensions
W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product)
Weight
1200KG (Subject to actual product)

Send your message to this supplier
Send Now

High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

Ask Latest Price
Product Detail
Production Cycle :
3s-12s
Chip Size :
0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
PR System :
256 grayscale levels / edge detection
Resolution :
1920pixel×2560pixel
Weight :
1200KG (Subject to actual product)
Standard Track Width :
40-90mm
Contact Supplier
High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

United Winners Laser Co., Ltd

Verified Supplier
1 Years
shenzhen
Since 2005
Business Type :
Manufacturer
Main Products :
Lasers and Welding Machines, EV Battery Manufacturing Equipment, 3C Industry Manufacturing Equipment
Total Annual :
5000000-8000000
Employee Number :
5000~6000
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Optical Communication Industry Welding Equipment
MachineU China Products Machinery Electronic Products Machinery
Contact Supplier
Submit Requirement