Equipment Introduction

The equipment’s laser system uses instantaneous high-energy-density laser to achieve ablation and evaporation, selectively removing masks or dielectric films, and is used to remove the BSG layer from designated areas of battery wafers. It supports an automatic loading and unloading system, compatible with the customer’s on-site AGV system. Carrier cassettes are automatically loaded from AGV to the equipment’s loading conveyor belt; silicon wafers are picked up automatically from cassettes, conveyed directly to the laser marking station, laser-marked after CCD visual positioning, and then sent to the unloading cassette via the unloading conveyor belt. Full cassettes are then transported to the on-site AGV by the conveyor belt.

Highlights

• Multi-functional Assistance for Enhanced Process Performance

• Bottom-mounted platform cooling system: prevents high-temperature interference for better process performance.
• Patented dedicated dust removal device: adopts suction-blown convection for higher cleanliness.
• Supports fragment, micro-crack, and AOI detection.

• Laser Processing Technology for Different Film Structures

• Diversified technology routes for varied mask layer materials.
• Customizable laser sources for optimal demand matching.

• Large Spot Beam Homogenization Technology

• Ensures uniform spot energy distribution.
• Maintains stable and consistent mass production with large spot size.

• Unique Design for Reduced Transmission Defects

• Custom grooved belt and direct motor connection: stable operation, dust contamination prevention.
• New flat belt: prevents scratches and indentations.
• The jig uses an air knife to blow away debris and prevent micro-cracks.

• Versatile Design for High Compatibility

• Compatible with multiple loading/unloading methods and carrier cassettes of different specifications.
• Lifting & rotating design with dedicated storage for empty cassettes.
• Supports fragment, micro-crack, and AOI detection.

• Precision Graphic Control Technology

• Pulse timing control: precise N/P region isolation.
• High-precision positioning.
• Visual AI algorithm development.
• Laser processing for different film structures, diversified technology routes, and customizable laser sources.

Technical Parameters