Product Description: Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power ...learn more
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check

Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check
300 sets per month
can negotiate
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Unicomp Technology

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8 Years
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