Product Description: Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1215(W)×1325(D)×1700(H)mm Machine Weight 1240 kg Power ...learn more
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check

Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check
300 sets per month
can negotiate
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Unicomp Technology

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9 Years
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