High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection Video from China

Electronics X Ray Machine

Jun 05, 2025

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Product Description: Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. ...learn more

High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection

High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection

45 days

CE, FCC

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Unicomp Technology

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8 Years

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