Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
The Unicomp AX9100max X-ray Inspection Systemis engineered specifically for IGBT module analysis and serves a broad range of industries, including:
BGA/CSP/Flip Chip packaging
LED & optoelectronic components
Fuse & diode manufacturing
PCB & semiconductor assembly
Battery production
Small metal castings
Electronic connector modules & cables
Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine