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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Specifications
Brand Name :
UNICOMP
Model Number :
AX9100max
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1 set
Price :
can negotiate
Payment Terms :
L/C,T/T
Supply Ability :
100set/montrh
Delivery Time :
15 days
Packaging Details :
Unicomp Wood.
Monitor :
27 "HD display
System OS :
Windows10 64-bit
Hard Disk :
1TB
RAM :
16G
CPU Model :
i7
Description
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Dimensions and appearance of Unicomp AX9100max X-ray Machine
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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

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Product Detail
Brand Name :
UNICOMP
Model Number :
AX9100max
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1 set
Price :
can negotiate
Contact Supplier
video
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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