MachineU > China Products > Machinery > Electronics Production Machinery
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
Specifications
Model Number :
AX9100MAX
Payment Terms :
L/C,T/T
Model :
AX9100MAX
Pixel :
1536*1536
MOQ :
1 set
Delivery Time :
15 days
Footprint :
1450(W)×1765(D)×1835(H)mm
Brand Name :
UNICOMP
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Price :
can negotiate
X-ray Tube Type :
sealed type
Supply Ability :
30 sets per month
Machine Type :
Semiconductor Electronic X-Ray Inspection System
Certification :
CE, FDA
Pixel Size :
84μm
Place of Origin :
China
Description
UNICOMP AX9100MAX X-Ray Inspection System
High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities.
System Overview
This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification.
Applications
BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, lithium battery assemblies, miniature precision metal castings, automotive electronic connector assemblies, wiring harnesses, and photovoltaic structural parts.
Key Advantages
  • Large inspection stroke for comprehensive coverage
  • Strong X-ray penetration capability
  • Flexible multi-angle positioning
  • Meets stringent quality control requirements for automotive electronics, new energy, photovoltaics, and high-density microelectronic manufacturing
System Specifications
Footprint1450(W) × 1765(D) × 1835(H) mm
Machine Weight2400 kg
Power Supply220V ±10%, 50/60Hz, 8A
Packaging Dimension1750(W) × 2280(D) × 2100(H) mm
Packing Weight2600 kg
Power Consumption1.8 kW
X-Ray Tube Specifications
Tube TypeSealed type
Max. Power Output65W
Voltage130kV
Focus Spot Size≤7μm
Imaging System
DetectorHigh Resolution FPD
Pixel Size84μm
Effective Detection Area129 × 129 mm
Frame Rates30fps
Pixel Matrix1536 × 1536
System Magnification1600X
Software Features
  • One-click zoom in & out with fast automatic navigation of ROI region
  • Fixed-point following during FPD tilting
  • Table automatic following while axis tilting separately
  • Algorithms for image super-resolution reconstruction
  • Intelligently improve overall image clarity with one-click
  • Automatic images comparison
  • Intelligently adjust overall image contrast with one-click
  • Variety of filter processing algorithms including sharpening, enhancement, color reversal, and denoising image preprocessing functions
Motion Control System
Movement Control MethodDual Joystick, Keypad & Mouse
Max. Loading SizeФ620mm
Max. Inspection SizeФ500mm
Tilting InspectionMaximum 60° (Tube & Detector)
Objective StageHorizontal Rotation 360°
Industrial PC Configuration
Monitor (Dual)27" 4K HD display
Operating SystemWindows 10 64bit
Hard Disk1TB
RAM16G
CPU ModelIntel i7 Processor
Safety & Security Features
  • Hand-operated door with electromagnetic interlock
  • Warning light and real-time radiation leakage monitor
  • Fingerprint access management system with password access support
  • X-Ray safety: <1μSv/h (Meets all international standards)
System Dimensions and Appearance
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
UNICOMP AX9100MAX X-Ray Machine dimensions and external appearance
Functions and Features
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
UNICOMP AX9100MAX X-Ray Machine functional features and capabilities
Sample Inspection Image
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
Sample inspection image showing high magnification PCB component analysis
Specifications are subject to change without notice. All trademarks are the property of the system maker.
Send your message to this supplier
Send Now

High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Ask Latest Price
Watch Video
Product Detail
Model Number :
AX9100MAX
Payment Terms :
L/C,T/T
Model :
AX9100MAX
Pixel :
1536*1536
MOQ :
1 set
Delivery Time :
15 days
Contact Supplier
video
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products
MachineU China Products Machinery Electronics Production Machinery
Contact Supplier
Submit Requirement