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160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
Specifications
Brand Name :
Unicomp
Model Number :
AX9600
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1 set
Price :
can negotiate
Payment Terms :
T/T,L/C
Supply Ability :
30 sets per month
Delivery Time :
30-35 days after order confirmation
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Machine Type :
Semiconductor Microfocus X-ray Inspection Equipment
Dimensions :
1690mm(L)×2116mm(W)×1880mm(H)
Tube Type :
Open Type
Machine Weight :
4590KG
Voltage :
160kv
Model :
AX9600
Description
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution tailored for advanced IC packaging, HBM storage dies, and GPU semiconductor device quality verification.
Technical Specifications
System Summary
Dimensions 1690mm(L)×2116mm(W)×1880mm(H)
Weight 4590kg
Power Supply 220V±10% 50Hz/60Hz 9A
Power Consumption 2kw
X-ray Tube
Tube Type Open Type
Voltage 160kv
Max. Power 64W
Min.Resolution 1µm
Imaging System
X-ray Detector FPD
Pixel Size 84µm
Detection Area 129*129mm
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
System Magnification 34000X
Motion Control System
Max. Payload Size 520*520[mm]
Max. Detection Size 520*520[mm]
X/Y/Z-Axis Travel Distance 550/710/265[mm]
Tilt and Rotation Detect XY±70° Tilt
Industrial PC
Motion Control Mode 34"HD 4K curved display
Operating System Windows 11 64-bit
Storage 4TB HDD+512G SSD
Memory 32G
Processor i5 12 generation
Other Features
Door Operation Automatic Door
X-Ray Safety <1µSv/h
Applications
The UNICOMP AX9600 high-power microfocus X-ray inspection system is engineered for ultra-precision non-destructive evaluation (NDE) of advanced semiconductors and microelectronic components. It delivers high-fidelity void fraction quantification for TVS diodes, alongside internal flaw inspection for advanced IC packages, HBM high-bandwidth memory dies, GPU modules and high-density electronic assemblies.
Extensively deployed for quality validation across automotive electronics, power semiconductors, aerospace-grade electronic hardware and miniature precision components, the system facilitates precise characterization of micro-voids, solder joint anomalies, internal fractures and assembly irregularities. It provides robust technical backing for R&D validation and mass production process quality control within the high-end semiconductor manufacturing sector.
Inspection Images
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
Sample Inspection Image
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
System Dimensions and Appearance
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160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp

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Product Detail
Brand Name :
Unicomp
Model Number :
AX9600
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1 set
Price :
can negotiate
Contact Supplier
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp
160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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