Specifications
Supply Ability :
30 sets per month
Model Number :
AX8300
Dimension :
1215*1325*1700(mm)
Certification :
CE, FDA
Power Supply :
220V,50Hz/60Hz 4A
MOQ :
1Set
Delivery Time :
15 days
Voltage :
110kv
Payment Terms :
T/T,L/C
Price :
can negotiate
Warranty :
1 year
Brand Name :
UNICOMP
Product name :
AX8300
Place of Origin :
China
Weight :
1350kg
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Description
Auto Void Detection X-ray Machine AX8300
High Motion Precision BGA Solder Joint Testing Equipment by Unicomp
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
QFN: Bridging, Voids, Opens, Registration
SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
Model AX8300
Max kV/Type 110 kV/Sealed
Power Consumption 900W
Max. Electron Beam Power 25W
Focal Spot Size 5μm
Geometric Magnification 48.8X
Imaging System (Option) Flat Panel Detector
Door Open Hand-operated door
Monitor 27" HD 4K Display
Dimensions 1215x1325x1700mm
Weight 1350kg
Radiation Safety <1μSv/hr
Control Keyboard/Mouse/Joystick
Automated Inspection Standard
Primary Applications Chip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment
All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Dimensions and Appearance
Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp
Inspection Images
Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp
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Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Ask Latest Price
Supply Ability :
30 sets per month
Model Number :
AX8300
Dimension :
1215*1325*1700(mm)
Certification :
CE, FDA
Power Supply :
220V,50Hz/60Hz 4A
MOQ :
1Set
Contact Supplier
Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp
Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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