Specifications
Supply Ability :
30 sets per month
Brand Name :
UNICOMP
Machine Type :
Semiconductor Electronic X-Ray Inspection System
Model Number :
AX9100MAX
Model :
AX9100MAX
Payment Terms :
L/C,T/T
Footprint :
1450(W)×1765(D)×1835(H)mm
Price :
can negotiate
Pixel :
1536*1536
Certification :
CE, FDA
X-ray Tube Type :
sealed type
MOQ :
1 set
Delivery Time :
15 days
Pixel Size :
84μm
Place of Origin :
China
Voltage :
130kv
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Description
AX9100MAX X-ray Inspection Equipment
High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components.
System Overview
This advanced X-ray inspection equipment performs precise nondestructive testing for semiconductor and industrial applications. Suitable for automotive electronics, new energy, photovoltaic, and high-density microelectronics manufacturing with comprehensive quality control and R&D validation capabilities.
Applications
  • BGA, CSP, and flip chip inspection
  • LED packaging and power diodes
  • Multi-layer PCB analysis
  • Discrete semiconductor components
  • Lithium battery modules
  • Precision castings and auto electronic connectors
  • Wire harnesses and PV components flaw detection
System Specifications
Footprint1450(W)*1765(D)*1835(H)mm
Machine Weight2400 kg
Power Supply220V±10%, 50/60Hz, 8A
Packaging Dimension1750(W)*2280(D)*2100(H)mm
Packing Weight2600 kg
Power Consumption1.8 kW
X-Ray Tube Specifications
Tube TypeSealed type
Max. Power Output65W
Voltage130kV
Focus Spot Size≤7μm
Imaging System
DetectorHigh Resolution FPD
Pixel Size84μm
Effective Detection Area129*129mm
Frame Rates30fps
Pixel Matrix1536*1536
System Magnification1600X
Software Features
  • One-click zoom with fast automatic ROI navigation
  • Fixed-point following during FPD tilting
  • Table automatic following during axis tilting
  • Image super-resolution reconstruction algorithms
  • One-click overall image clarity enhancement
  • Automatic images comparison
  • One-click overall image contrast adjustment
  • Multiple filter processing algorithms including sharpening, enhancement, color reversal, and denoising
Motion Control System
Movement Control MethodDual Joystick, Keypad & Mouse
Max. Loading SizeФ620mm
Max. Inspection SizeФ500mm
Tilting InspectionMaximum 60° (Tube & Detector)
Objective StageHorizontal Rotation 360°
Industrial PC Configuration
Monitor (Dual)27" 4K HD display
Operating SystemWindows 10 64bit
Hard Disk1TB
RAM16G
CPU ModelIntel i7 Processor
Safety & Security Features
  • Hand-operated door with electromagnetic interlock
  • Warning light and real-time radiation leakage monitor
  • Fingerprint access management system with password support
  • X-Ray safety: <1μSv/h (Meets all international standards)
System Visual Reference
Dimensions and Appearance
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp
Functions and Features
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp
Inspection Image Sample
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp
Specifications are subject to change without notice. All trademarks are the property of the system maker.
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Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp

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Supply Ability :
30 sets per month
Brand Name :
UNICOMP
Machine Type :
Semiconductor Electronic X-Ray Inspection System
Model Number :
AX9100MAX
Model :
AX9100MAX
Payment Terms :
L/C,T/T
Contact Supplier
video
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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