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Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Specifications
Model Number :
AX8300
Dimension :
1215*1325*1700(mm)
MOQ :
1Set
Delivery Time :
15 days
Voltage :
110kv
Payment Terms :
T/T,L/C
Price :
can negotiate
Warranty :
1 year
Certification :
CE, FDA
Power Supply :
220V,50Hz/60Hz 4A
Supply Ability :
30 sets per month
Brand Name :
UNICOMP
Product name :
AX8300
Place of Origin :
China
Weight :
1350kg
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Description
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models.
Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects.
Key Features
  • 110kV Microfocus X-ray source
  • High resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt Motions (table, tube, FPD)
  • 360° Table Rotation
  • Angle View up to 70 Degrees
  • Point and Click Location Navigation
  • CNC Programming for Multiple Image Inspection Routines
  • Maximum Inspection Area: 360 x 340mm
Applications
BGA/CSP/FLIPS CHIP: Bridging, Voids, Opens, Excessive/Insufficient solder
QFN: Bridging, Voids, Opens, Registration
SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
Semiconductor: Bond wire, Die attach VOID, MOLD, VOID
Multi-layer Board (MLB): Inner layer registration, PAD stack, Blind/buried vias
Technical Specifications
ModelAX8300
Max kV/Type110 kV/Sealed
Power Consumption900W
Max. Electron Beam Power25W
Focal Spot Size5μm
Geometric Magnification48.8X
Imaging System (Option)Flat Panel Detector
Door OpenHand-operated door
Monitor27" HD 4K Display
Dimensions1215x1325x1700mm
Weight1350kg
Radiation Safety<1μSv/hr
ControlKeyboard/Mouse/Joystick
Automated InspectionStandard
Primary ApplicationsChip inspection/Electronic components/Auto parts, etc.
Note: Focal spot size is variable. Please consult Unicomp for specific requirements.
X-ray Safety Commitment
All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems. The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.
Dimensions and Appearance
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Unicomp AX8300 X-ray Inspection Machine dimensions and external appearance
Inspection Images
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Unicomp AX8300 X-ray inspection sample image
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Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control

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Product Detail
Model Number :
AX8300
Dimension :
1215*1325*1700(mm)
MOQ :
1Set
Delivery Time :
15 days
Voltage :
110kv
Payment Terms :
T/T,L/C
Contact Supplier
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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