CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual
Features:
● 130KV 7μm X-Ray Sealed tube.
● High speed & Millions pixels high resolution FPD.
● 1000X magnification, high-definition real-time image.
● One-button operation with 2.5D image display.
● Off-line programming function, navigation mode detection.
● 7 axis linkage, 70 degree tilt detection.
Applications:
● SMT, BGA, CSP, Flip Chip, LED Detection.
● Semiconductor, Packaging components, Battery Industry.
● Electronic components, Auto parts, Photovoltaic Industry.
● Aluminum Die-casting, Moulding Plastic.
● Ceramics, Other Special Industries.
| Item | Definition | Specs |
| System Parameters | Size | 1485(L)x1420(W)x1710(H)mm |
| Weight | 2070kg | |
| Power | 220V±10% 50Hz/60Hz 5A | |
| Power Consumption | 1.2kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 130kV | |
| Max.Power | 65W | |
| Spot Size | 7μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 27 ‘’4K HD display | |
| System Magnification | 1600 X | |
| Detection Region | Max.Loading Size | 720*600[mm] |
| Max.Inspection Area | 590mm x 510mm | |
| X-ray Leakage | <1μSv/h | |
Test Images:
