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BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
Specifications
Brand Name :
UNICOMP
Model Number :
AX8300
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Payment Terms :
T/T,L/C
Supply Ability :
30 sets per month
Delivery Time :
30 days
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Name :
Electronics X Ray Machine
Measuring volume :
Max load area 300x300mm
Tube Voltage :
110KV
Industry :
Electronics Industry
Size :
1100(L)x1100(W)x1650(H)mm
Radiation safety :
<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm
Description

SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv



AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on.



Major applications:


PCBA BGA/IC LED Aliminum die casting Battery connector inspecting


1. Semiconductor package


2. Electronic connector module.


3. Original Package


4. Aerospace components


5. Medical appliances


6. Automation components



Application:


1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient

2. QFN:Bridging,Voids,Opens,Registration

3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others

4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID

5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias




Product tags

toshiba x-ray tube

,

x ray tube power supply

,

toshiba x ray tube
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BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance

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Product Detail
Brand Name :
UNICOMP
Model Number :
AX8300
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1Set
Price :
can negotiate
Contact Supplier
video
BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
600~700
Certification Level :
Verified Supplier
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