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Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Specifications
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Pixel Size :
84μm
Focus Spot Size :
5μm
Voltage :
90kV
Brand Name :
Unicomp
Model Number :
AX7900
Certification :
CE, FDA
Place of Origin :
China
MOQ :
1 set
Price :
can negotiate
Payment Terms :
L/C,T/T
Supply Ability :
300 sets per month
Delivery Time :
15 days after order confirmation
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Detector :
Flat Panel Detector (FPD)
Name :
Unicomp X-ray Inspection Machine
Description

Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection

Description:


90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 600mm x 520mm ,detection area 129 x 129mm, with ~52X Geometric Magnification.



FEATURES:


90KV 5μm X-ray tube, FPD Detector.


Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).


Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).


Multi-function DXI image processing system.


X/Y programming function for multiple image inspection routines


Max. loading area 600mm x 520mm, detection area 129 x 129mm, with ~52X Geometric Magnification.


BGA void/area auto-measurement plus report generation.



APPLICATION:


LED, SMT, BGA, CSP, Flip Chip Inspection.


Semiconductor, Packaging components, Battery Industry.


Electronic components, Auto parts, Photovoltaic Industry.


Aluminum Die Casting, Moulding Plastic.


Ceramics, Other Special Industries

Specifications:

System Summary
Footprint 1215(W)×1325(D)×1700(H)mm
Machine Weight 1240 kg
Power Supply 220V, 50/60Hz
Plywood Packing Size 1680(W)×1680(D)×2200(H)mm
Packing Weight 1470 kg
Power Consumption 0.8 kW
X-Ray Tube
Tube Type Sealed
Max. Power 8W
Voltage 90kV
Focus Spot Size 5μm
Imaging System
Detector Flat Panel Detector (FPD)
Pixel Size 84μm
Detection Area 129*129mm
Frame Rates 30fps
Pixel Matrix 1536*1536
Geometric Magnification 52X
Software
Auto-measuring BGA Soldering Voids Auto-measuring and Support Data/Graphic Output
Multiple Measuring Tools Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc.
CNC Mode CNC Programmable Inspection, Easy Operation and User Friendly
Real-time Display Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc
Navigation Convenient Target Point Positioning System
Motion Control System
Movement Control Joystick, Keypad & Mouse
Max. Loading Area/Weight 600*520mm / 10kg
Max. Inspection Area 505*440mm
Tilting Angle ±30°
Manipulator 5-axis with X / Y / Z1 / Z2 / T
Industrial PC
Monitor 24’’ HD Display
System OS Windows 11 64bit
Hard disk 1TB
RAM 16GB
CPU model Intel i7 Processor
Other Features
Energy Saving X-Ray Auto-off when it's out of work over than 5 minutes
X-Ray Safety <1μSv/h (Meets All International Standards)
Authority Management Fingerprint Access Magnagement System, and Support Password Accessing.
Safety Operation Electromagnetic Interlock, Warning Light and Real-time Radioation Leakage Monitor
* Specifications are subject to change without notice, All trademarks are the property of the system maker.


Xray images


Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection

Product tags

refurbished x ray equipment

,

lcd screen repair kit

,

x ray developer solution
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Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection

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Product Detail
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Pixel Size :
84μm
Focus Spot Size :
5μm
Voltage :
90kV
Brand Name :
Unicomp
Model Number :
AX7900
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Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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