Jietai Ultrasonic/Fully Automatic Ultrasonic Cleaning Machine For Semiconductor Wafers
- Five-stage cleaning process to overcome the challenges of cleaning complex curved surfaces
A customized five-stage cleaning process of ultrasonic rough cleaning → high-pressure spraying → fine brushing with brushes → ultrasonic rinsing → hot air drying is designed to address the three major pollution sources of camera frames (aluminum alloy/stainless steel/ceramic materials), namely CNC machining residues, electroplating oil stains, and fingerprint and sweat stains:
- Dual-frequency ultrasonic collaboration: The 28kHz low-frequency ultrasonic (15kW) breaks up hard particles remaining from CNC cutting fluid, while the 40kHz high-frequency ultrasonic (10kW) removes 0.1μm-level oil stains on the electroplated layer surface. The measured cleanliness rate of the inner wall of blind holes reaches 99.2%.
- Bionic brush system: Nylon bristle brushes with a diameter of 0.05mm (Shore hardness 50°) are used, combined with a ±1mm profile-following floating mechanism. This ensures a perfect fit to the R corners (minimum R0.3mm) of the frame and the coated surface, achieving zero scratches during the cleaning process (surface roughness Ra≤0.2μm).
- Full-automatic intelligent control, increasing the yield rate by 30%




