Ultrasonic Tinning, Dip Tinning, Tin Coated On The Copper Wire By Ultrasound With Temperature Control Systerm

20Khz Ultrasonic Tinning, Dip tinning, Tin coated on the copper wire by ultrasound with temperature control systerm

Product Introduction:

We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.

Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.

A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this.

A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.

Coating a ceramic with solder is an example of this process.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The advantages of removing flux from the process are that there is no need for post-process

cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process

cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of

eliminating wicking is that the solder coating on the base material can be better controlled.

Parameter:

Characteristics

• User-friendly interface

• By combining Greatcell Solar ultrasonic solderer with peculiar solderer alloys, the customer can solder directly on glass/ceramics/unsolderable materials.

• New feed-back method developed from careful research of oscillator frequency settings enables stable, reliable work.

• Output adjustable by stepless control

• emperature can be set within 200°C 500°C by 10°C unit

Application:

• Small scale production.

• For use in laboratory conditions, while preparing data before mass production and for inspection purposes.

• Soldering electrodes for display goods.

• Soldering electrodes for solar cells.

• Soldering electrodes on highly conductive

• ceramic substrates.Bonding electronic parts.

• Product picture:

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