1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU
| Attribute | Value | Test Method |
|---|---|---|
| Product | TC1500B | - |
| Composition | Silicone + Fiberglass Carrier | - |
| Color | Yellow | Visual |
| Thickness(mm) | 0.25 | astm d374 |
| Usage Temperature(℃) | -40~200 | -- |
| Shear Strength(MPa)@RT | 1.4 | ASTM D1002 |
| Electrical | ||
| Breakdown Voltage(kv/mm) | > 4.5 | ASTM D149 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Dielectric Constant(@1MHz) | 5 | ASTM D150 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 1.4 | ASTM D5470 |
| Curing time | ||
| @160~180℃(mis.)3 | 6 | -- |
Product feature
■ 1.4 W/m.K
■ High insulation and voltage withstand characteristics
■ Low thermal resistance
■ Electrically insulating
■ High shear strength
■ -Wear resistant, not easy to puncture, easy to use
Typical applications
■ Networking and Telecommunications
■ Industrial: Power Supplies
■ Automotive: Power Modules, Inverters, LED
■ Consumer Electronics: Power Supplies, AC/DC Converting
The different thermal conductive pad have different application areas, any application solution question,welcome to check with our team.
