In liquid cooling systems, the pressure resistance and temperature resistance parameters of fluid quick-connect fittings vary depending on product materials, structural designs, and application scenarios (such as new energy vehicles, data centers, and charging piles). Below are the general parameter ranges and selection references commonly used in the industry:
Pressure Resistance Parameters
Pressure resistance capacity is a core indicator of quick-connect fittings, which directly determines the pressure rating of the liquid cooling system they are compatible with.
Standard Industrial Grade: The pressure resistance range is 1.0–3.0 MPa (approximately 10–30 bar), suitable for low-pressure circulation systems such as liquid cooling plates for data center servers and small charging piles.
High Pressure Resistance Grade: The pressure resistance can reach 3.0–6.0 MPa, used in liquid cooling circuits for power batteries of new energy vehicles (where the system pressure fluctuates significantly and higher impact pressure resistance is required).
Testing Standards: Qualified products must pass a hydrostatic test at 1.5 times the rated pressure without leakage or deformation. For some high-demand scenarios, a pulse pressure test (simulating long-term pressure fluctuations) will be additionally conducted.

• Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.
• Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.
• Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.
• Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.

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