Specifications
Brand Name :
Uchi
Model Number :
DIMM
Certification :
SMC
Place of Origin :
Dongguan,Guangdong,China
MOQ :
100pcs
Price :
Negotiable
Payment Terms :
T/T,paypal, Western Union,MoneyGram
Supply Ability :
50000000pcs per Month
narrow-pitch memory layout :
Compatible with DIMM pitches ranging from 0.297 to 0.35 inches
fin density :
≥ 8 fins/cm
Heat Dissipation Capacity :
≥ 22W
Thermal Resistance :
0.05 °C·cm²/W
Materials :
copper + aluminum alloy
thermal conductivity :
≥ 401 W/m·K
Description
High-Density DIMM Liquid Cooling Radiator for Servers (Compatible with DDR5/MRDIMM Memory)

Technical Specifications


  • Structural Design: Modular cold plate + independent memory cooling fins (copper microchannels, fin density ≥ 8 fins/cm); supports narrow-pitch memory layouts (compatible with DIMM pitches of 0.297–0.35 inches), and a single cold plate can cover 8–16 memory sticks.
  • Heat Dissipation Performance: Heat dissipation capacity per memory stick ≥ 22W (compatible with high-power DDR5 memory), with thermal resistance as low as 0.05℃·cm²/W; when paired with coolants (e.g., PG25), the memory temperature can be controlled below 50℃ under full load.
  • Interface & Compatibility: Equipped with UQD quick-connect fittings (leakage rate < 10⁻⁶ Pa·m³/s) and supports blind mating (error compensation of 0.8mm); compatible with MRDIMM/DDR5 memory, and suitable for architectures such as 2U/4U servers and AI compute sleds.
  • Materials & Dimensions: Main body made of electrolytic copper + aluminum alloy (thermal conductivity ≥ 401 W/m·K), with a single module weight < 250g; cold plate dimensions are compatible with standard server chassis (e.g., 1U half-width nodes).

Application Fields


  • AI Data Centers: Compatible with MRDIMM memory of AI servers such as GB300/NVL72, supporting high-density computing clusters for large language model training and inference scenarios.
  • High-Performance Computing (HPC): Used for heat dissipation of high-bandwidth memory modules in supercomputing and scientific simulations (e.g., climate modeling, genome sequencing).
  • Cloud Computing Servers: Suitable for 2U/4U high-density rack servers (e.g., Inspur Sleeper architecture), meeting the heat dissipation requirements of multiple memory slots in virtualized and containerized environments.
Cold Plate Radiator Design

We design internal flow channels based on customer-provided power consumption data and heat distribution patterns to meet specific temperature rise and uniformity requirements while maintaining acceptable fluid flow resistance.

Our design process includes comprehensive simulation analysis of temperature and pressure drop, with iterative adjustments to internal parameters until both thermal and hydraulic performance targets are achieved.

High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Production Equipment

Our manufacturing facility is equipped with state-of-the-art equipment for liquid cold plate production:

Equipment Type Quantity Technical Parameters
Tunnel Brazing Furnace 2 Units Max Welding Dimension: 1000mm (W) × 250mm (H), length unlimited
Max Welding Temperature: 950℃
Applicable Materials: Copper, Aluminum
Vacuum Brazing Furnace 2 Units Max Welding Dimension: 800mm × 1200mm × 800mm
Max Welding Temperature: 1200℃
Applicable Materials: Copper, Aluminum, Stainless Steel
Helium Leak Detection Equipment 2 Units Max Testing Dimension: 2500mm × 750mm × 700mm
Testing Pressure Range: 0-3MPa
Testing Precision: 2g/year or ≤1×10⁻⁶ Pa*m³/s
Hydrostatic Testing Equipment 2 Units Max Testing Dimension: 2500mm × 1500mm × 1000mm
Testing Pressure Range: 0-5MPa
Pneumatic Testing Equipment 2 Units Max Testing Dimension: Unlimited
Testing Pressure Range: 0-5MPa
Testing Precision: 1Pa
High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Advanced Brazing Technology

Our vacuum brazing process joins aluminum plates using filler metal with lower melting points than the base material, creating extremely strong joints without residual corrosive flux. This high-end technology provides uniform heating, precise temperature control, eliminates post-cleaning requirements, and minimizes part distortion.

High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory) High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)

In a high-power liquid cooling system, a heat sink (liquid cold plate) capable of rapid heat absorption is required to transfer heat quickly. Leveraging the high specific heat capacity of liquids, the liquid cooling system transfers large amounts of heat through liquid flow, and it is recognized as one of the most effective heat dissipation methods available today. It can dissipate heat ranging from several hundred watts to over one kilowatt.

  1. Buried-tube Liquid Cold Plate: The cold plate is fabricated by grooving the upper and lower plates, burying and welding copper tubes inside, and then hermetically sealing the assembly via welding. Since the copper tubes are embedded and welded within the heat sink, reliable liquid tightness and operational safety are guaranteed. The surface of the cold plate can be precision-machined to achieve high flatness, ensuring excellent thermal contact with heat sources.
  2. Inserted-tube Liquid Cold Plate: This type of cold plate is manufactured by embedding copper tubes onto the surface of an aluminum plate using welding or bonding processes, with strict flatness control maintained. The copper tubes are in direct contact with the heat source, which minimizes thermal resistance and enhances heat dissipation efficiency.
  3. Channel-type Liquid Cold Plate: For this cold plate, internal flow channels are formed on copper or aluminum substrates through processes such as drilling, aluminum extrusion, and precision machining. The channels are then sealed using friction welding or high-temperature brazing. It offers advantages including low manufacturing costs and the ability to be fabricated with complex flow channel geometries.
  4. Liquid Cooling Block: For products requiring heat dissipation for high-power chips, liquid cooling blocks can be employed. Internal flow channels are created through skiving fin technology to maximize the heat exchange surface area.

    opper-brazed Liquid Cooling Products


    GB200 liquid cooling module, H20 liquid cooling module, optical module liquid cooling module, other copper cold plates. Compatible with solders including phosphor copper, silver-based, nickel-based and gold-based variants.

    Aluminum-brazed Liquid Cooling Products


    LTS siphon radiator, die-cast electronic control liquid cooling box, power supply stamped liquid cooling plate, motor electronic control liquid cooling plate, 6G-3DRVC radiator, other brazed liquid cooling radiators.

    Stainless Steel-brazed Liquid Cooling Products


    Liquid cooling manifold, DIMM liquid cooling module, other stainless steel liquid cooling manifolds.
    High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Key Applications
  • Lasers and medical equipment
  • EV power battery pack cooling
  • Power electronics and motor drive devices
  • Microwave 5G transmission systems
  • Renewable energy systems
  • IGBT and Power Semi-Conductor Systems
  • Data centers and industrial power applications
  • Defense systems and avionics
  • Fuel cells and traction systems
High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Quality Assurance

We maintain rigorous quality standards with comprehensive testing equipment including:

  • 1 Coordinate Measuring Machine
  • 1 projector instrument
  • 2 water high pressure testing machines
  • 4 thermal resistance testing machines
  • 2 liquid leakage testing machines
High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)
Customer Service
  • Prompt response to all inquiries
  • Competitive pricing with guaranteed quality
  • Efficient production scheduling
  • Optimal transportation solutions
  • Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?

We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.

Have you exported goods before and to which regions?

60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.

How many employees do you have?

Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.

Can you provide samples if we agree with the design?

Yes, we provide samples for confirmation before mass production, along with technical drawings if required.

What packing methods do you use?

Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.

Do you provide technical support for product issues?

All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

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High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)

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Brand Name :
Uchi
Model Number :
DIMM
Certification :
SMC
Place of Origin :
Dongguan,Guangdong,China
MOQ :
100pcs
Price :
Negotiable
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High-Density DIMM Liquid Cooling Radiator For Servers (Compatible With DDR5/MRDIMM Memory)

Guangdong Uchi Electronics Co.,Ltd

Verified Supplier
13 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Exporter
Total Annual :
1,500,000-2,500,000
Employee Number :
138~168
Certification Level :
Verified Supplier
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