Description
Titanium sputtering targets are high-purity materials used in thin-film deposition for wear-resistant, decorative, semiconductor, and optical coatings.
Titanium (Ti) is a lustrous, silvery-white metal known for its high strength-to-weight ratio, excellent corrosion resistance, and biocompatibility.
With a melting point of 1660°C, density of 4.5 g/cm³, and vapor pressure of 10⁻⁴ Torr at 1453°C, titanium is ideal for high-temperature and vacuum applications.
Its strong yet lightweight nature makes it a preferred choice in aerospace, marine, biomedical, and luxury goods manufacturing.
Titanium sputtering targets are evaporated under vacuum and used to deposit thin films of Ti, TiN, or TiO₂ for functional and decorative coatings.
| Item | Titanium Sputtering Target |
|---|---|
| Material | High Purity Titanium (99.5%, 99.995%) |
| Grades | Gr1, Gr2, Gr5 (Ti-6Al-4V), Gr7 |
| Standards | ASTM B381, ASTM B265, ASTM F67, ASTM F136 |
| Shapes Available | Disc / Rectangular Plate / Custom Size |
| Applications | Decorative coatings, optical coatings, semiconductors, integrated circuits, and wear-resistant films |
| Grade | Tensile Strength (MPa min) | Yield Strength (MPa min) | Elongation (% min) |
|---|---|---|---|
| Gr1 | 240 | 170 | 24 |
| Gr2 | 345 | 275 | 20 |
| Gr3 | 450 | 380 | 18 |
| Gr4 | 550 | 483 | 15 |
| Gr5 | 895 | 828 | 10 |
| Gr7 | 400 | 275 | 18 |
| Gr9 | 620 | 483 | 15 |
| Gr12 | 483 | 348 | 18 |
| Gr23 (Gr5 ELI) | 793 | 759 | 10 |
| Grade | Fe (max) | O (max) | N (max) | C (max) | H (max) | Pd (%) | Al (%) | V (%) | Ni (%) | Mo (%) |
|---|---|---|---|---|---|---|---|---|---|---|
| Gr1 | 0.20 | 0.18 | 0.03 | 0.08 | 0.015 | — | — | — | — | — |
| Gr2 | 0.30 | 0.25 | 0.03 | 0.08 | 0.015 | — | — | — | — | — |
| Gr3 | 0.30 | 0.35 | 0.05 | 0.08 | 0.015 | — | — | — | — | — |
| Gr4 | 0.50 | 0.40 | 0.05 | 0.08 | 0.015 | — | — | — | — | — |
| Gr5 | 0.40 | 0.20 | 0.05 | 0.08 | 0.015 | — | 5.5–6.7 | 3.5–4.5 | — | — |
| Gr7 | 0.30 | 0.25 | 0.03 | 0.08 | 0.015 | 0.12–0.25 | — | — | — | — |
| Gr9 | 0.25 | 0.15 | 0.03 | 0.08 | 0.015 | — | 2.5–3.5 | 2.0–3.0 | — | — |
| Gr12 | 0.30 | 0.25 | 0.03 | 0.08 | 0.015 | — | 0.6–0.9 | 0.2–0.4 | — | — |
| Gr23 (Gr5 ELI) | 0.25 | 0.03 | 0.03 | 0.08 | 0.0125 | — | 5.5–6.5 | 3.5–4.5 | — | — |
Base Element: Ti (Balance)
Used for hardware tool coating, decorative coating, semiconductor components, and flat-panel display coatings.
It is a core material for integrated circuit fabrication, typically requiring purity ≥99.99%.
Used in semiconductor and reflective coating applications.
Aluminum offers excellent heat resistance, electrical conductivity, and low weight, making it ideal for containers, automotive, and aerospace coatings.
Employed where high electrical conductivity is essential, such as ein lectrodes, thin-film circuits, and conductive coatings.
Used to enhance corrosion resistance and surface durability in coated materials.
Provide a protective corrosion-resistant barrier on base metals. Common in batteries, paints, and cathodic protection coatings.
Applied for electronic instruments, sensors, and electrode coatings due to their chemical stability, conductivity, and reflectivity.
High melting point and chemical stability
Excellent adhesion in PVD/CVD processes
Corrosion resistance in both oxidizing and reducing environments
Available in multiple shapes and purity levels
High film uniformity and purity for semiconductor applications