Description

Sputtering targets are the source materials from which thin films are deposited using the sputtering process. These targets are fabricated from high-quality metals or ceramics through advanced melting, sintering, and machining techniques.

We offer a wide range of sputtering targets in various materials, purities, and geometries, including customized options. Depending on your application, the fabrication method can be optimised for best performance — ensuring ideal density, purity, and grain structure for thin film deposition.

Specification

Applications

Titanium Targets

Titanium sputtering targets are widely used in hardware coating, decorative coating, semiconductor components, and flat panel display coating. Titanium is one of the key materials in integrated circuit production, where purities often exceed 99.99%.

Other Common Target Materials

Aluminium (Al): Used for semiconductor and heat-resistant coatings.

Copper (Cu): Ideal for electrodes and conductive coatings.

Tin (Sn): Enhances corrosion resistance.

Zinc (Zn): Provides protective coatings and serves as a corrosion barrier.

Precious Metals (Pt, Ag, Au): Offer chemical inertness and high electrical conductivity, suitable for high-precision electronic applications.

Key Features

High purity up to 99.995%

Excellent film adhesion and uniformity

Strong corrosion resistance and mechanical stability

Customizable shapes, sizes, and alloy compositions

Manufactured to meet ASTM and ISO standards

Typical Applications

Semiconductor and microelectronic devices

Optical coatings (beam splitters, anti-reflective layers)

Decorative coatings (watches, jewellery, consumer electronics)

Aerospace and automotive protective coatings

Biomedical surface modification (implants and instruments)