The absence of moisture reduces the decomposition of the electrolyte and extends the service life of the plating solution by more than 30%.

Case: After a certain PCB enterprise used it, the porosity of the gold plating layer decreased to 5 per square centimeter.

Avoiding side reactions in an anhydrous environment and increasing the yield of intermediates (measured +12%).

Provide a DMF residue detection report (< 10ppm).

Ultra-low moisture content (< 0.05% optional), meeting the experimental requirements of lithium-sulfur batteries.

• Metalworking and Surface Treatment: Used as brightener and stabilizer in electroplating solutions for silver and gold plating, improving coating gloss and adhesion.
• Ore Flotation and Metallurgy: Acts as collector or inhibitor in metal ore flotation, particularly for copper, lead, and zinc sulfide ores.
• Chemical and Materials Science: Used in resin modification, plastic additives, and functional materials synthesis.
• Environmental Protection: Effective in wastewater treatment for heavy metal removal and exhaust gas purification.
• Medicine and Biotechnology: Important intermediate for drug synthesis and protein research applications.
• Agriculture and Food Industry: Potential as plant growth regulator and food preservative.
• Photography: Used in black and white photo development processes.
• Laboratory Research: Serves as analytical reagent and in crystal growth experiments.
• New Energy: Applications in battery technology and hydrogen energy storage research.
• Other Applications: Used as preservative and in nanomaterial preparation.

• Precious Metal Metallurgy: Alternative to cyanide with 95% gold leaching rate and significantly lower toxicity.
• Electroplating Additives: Enhances coating density and extends salt spray test time to over 120 hours.
• Pharmaceutical Intermediates: Used in synthesis of antithyroid drugs with purity reaching EP9.0 standard.
• Dyeing and Printing: More stable reducing agent than sodium hyposulfite with 12-month storage capability.