Specifications
Brand Name :
AMPFORT
Model Number :
8810F
Certification :
UR
Place of Origin :
Dongguan,China
MOQ :
1000pcs
Price :
0.5~0.7 USD/PC
Payment Terms :
T/T
Supply Ability :
200,000PCS PER DAY
Delivery Time :
7 workdays
Packaging Details :
T/R,1K/REEL
Name :
Chip Fuse
Dimension :
7.3x5.8x4.2mm
Operating temperature :
-55~+125C
Rated Voltage :
24V~125V
Rated current :
20A~125A
Speed :
Fast Acting
Mounting Type :
Surface Mount
Fuse Type :
Board Mount (Cartridge Style Excluded)
Case :
2-SMD, J-Lead
HTSUS :
8536.10.0040
ECCN :
EAR99
RoHS Status :
ROHS3 Compliant
Description

8810F Ultra-High Current Nano2 Fast Blow Subminiature SMD Chip Fuse 7.3x5.8x4.2mm 60A 70A 80A 100A 125A 125V Max.

Description Of The Subminiature SMD Chip Fuse

This high-current SMD fuse is a small, square, surface mount fuse that is designed as supplemental overcurrent protection for high-current circuits in various applications.

Ordering Info Of The Subminiature SMD Chip Fuse

Part Ampere Voltage Breaking
No. Rating Rating Capacity
RM.8810F.20 20A

125V/120V/100V/85V/80V/

75V/72V/63V/58V/48V/32V

1500A@24V32V48V58V63V72V75V85VDC,

1000A@100VAC,300A@125V120V115V DC

RM.8810F.25 25A
RM.8810F.30 30A
RM.8810F.32 32A
RM.8810F.35 35A
RM.8810F.40 40A
RM.8810F.45 45A
RM.8810F.50 50A
RM.8810F.60 60A
RM.8810F.70 70A
RM.8810F.80 80A
RM.8810F.100 100A
RM.8810F.125 125A

Product Characteristics Of The Subminiature SMD Chip Fuse

NO.

Item

Content

Reference standards

1

Product Marking

Brand, Ampere Rating Marking standards
2

Operating Temperature

-55°C to 125°C –55ºC to 125ºC with proper derating
3

Solderability

T=240°C±5°C , t=3sec±0.5sec, Coverage≥95% MIL-STD-202, Method 208
4

Resistance to Soldering Heat

10 sec at 260°C MIL-STD-202, Method 210, Test condition B
5

Insulation Resistance (after Opening)

10,000 ohms minimum MIL-STD-202, Method 302, Test Condition A
6

Thermal Shock

5 cycles, -65°C / +125°C, 15 minutes at each extreme MIL-STD-202, Method 107, Test Condition B
7

Mechanical Shock

100G’s peak for 6 milliseconds, 3cycles MIL-STD-202, Method 213, Test I
8

Vibration

0.03”amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs MIL-STD-202, Method 201
9

Moisture Resistance

10 cycles MIL-STD-202, Method 106
10

Salt Spray

5% salt solution, 48hrs MIL-STD-202, Method 101, Test Condition B

Typical Application Of The Subminiature SMD Chip Fuse

• Storage system power

• Cooling fan system for PC server

• Voltage regulator module

• Base station power supply

• Voltage regulator module for PC server

• High end servers / Blade computing

• Blade Servers
• Routers

• Drones

• Battery and BMS

• Telecom DC/AC Power
• Uninterrupted Power supply (UPS)
• High-power Battery Systems
• Power Factor Correction (PFC) in high wattage power supplies
• Power Distribution Units (PDUs)
• Industrial tools

• Battery Management System

Features Of The Subminiature SMD Chip Fuse

• Small size with high interrupting
• Low DCR, lower power dissipation
• Faster blow when fault condition happens
• Higher reliability standards refer to automotive items

• Fast acting

• Surface mount high current fuse

• Higher voltage rating up to 125VDC

• 7.3mm×5.8mm×4.2mm rectangle shape surface mount

• -55°C to 125°C Operating temperature

• Excellent environmental integrity

• Enhanced thermal cycling endurance

• RoHS compliant

• Halogen Free

• Pb Free

Benefits Of The Subminiature SMD Chip Fuse


• Single fuse solution for high current application requirements. Parallel fusing or use of over specked industrial type fuses can be avoided
• High wattage equipment can be designed with less board space reserved for protection components
• Relatively high interrupting rating will suit a wide variety of applications
• Guaranteed protection against overload and short circuit events in applications
• Enhance power efficiency by optimized thermal performance and minimizing power loss
• Applicable to a wide range and harsh operating environment
• Enhanced reliability and less susceptible to temperature cycling and vibration effects
• Environmental friendly and harmless to human
• Compatible with high volume assembly (Pick-and-place) requirements with the SMD configuration

Do you have selection table for customers ?

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8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.

Ask Latest Price
Brand Name :
AMPFORT
Model Number :
8810F
Certification :
UR
Place of Origin :
Dongguan,China
MOQ :
1000pcs
Price :
0.5~0.7 USD/PC
Contact Supplier
8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.
8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.
8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.
8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.
8810F Ultra SMD Chip Fuse High Current Nano2 Fast Blow Subminiature 80A 125A 125V Max.

Dongguan Ampfort Electronics Co., Ltd.

Verified Supplier
5 Years
guangdong, dongguan
Since 2014
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Exporter
Total Annual :
1850000-2340000
Employee Number :
51~200
Certification Level :
Verified Supplier
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