Thickness 2.0mm Thermal Conductive Silicone Pad 2.6W/MK For Heat-Sink GPU Video from China

Silicone Thermal Pad

May 03, 2026

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Product Description: Thickness 2.0mm Thermal Conductive Silicone Pad 2.6W/MK For Heat-Sink GPU Products description TIF®500BS Series is an ultra-soft thermal interface material designed specifically to protect precision ...learn more

Thickness 2.0mm Thermal Conductive Silicone Pad 2.6W/MK For Heat-Sink GPU

Thickness 2.0mm Thermal Conductive Silicone Pad 2.6W/MK For Heat-Sink GPU

1000000 pcs/month

0.1-10 USD/PCS

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Dongguan Ziitek Electronical Material and Technology Ltd.

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8 Years

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