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Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Specifications
Brand Name :
Ziitek
Model Number :
TIF540BS
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Product ame :
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Thickness :
1.0mmT
Specific Gravity :
3.0g/cc
Dielectric Breakdown Voltage :
>5500 VAC
Thermal conductivity :
2.6W/m-K
Color :
Blue
Keywords :
Thermal Conductive Pad
Application :
CPU/LED/PCB/GPU/SSD
Description

Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


The TIF®540BS Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features


> Good thermal conductive: 2.6W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications


> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

Typical Properties of TIF®500BS Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 30 Shore 00 13 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ＞1.0X1013 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.6 W/m-K ASTM D5470
2.6 W/m-K ISO22007

Product Specification
Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).

Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

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Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF540BS
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad
Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB Silicone Thermal Pad GPU SSD Thermal Pad

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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