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Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
Specifications
Brand Name :
Ziitek
Model Number :
TS-TIR300L
Certification :
RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10USD/pcs
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
24*13*12cm cartons
Products Name :
Graphite Composite Thermal Pad For Between Transistors And Heat Sinks
keywords :
Graphite Composite Thermal Pad
Application :
Between Transistors And Heat Sinks
Feature :
Excellent thermal impedance
Thermal conductiivity :
2.5W/m-K
Color :
Black
Thickness :
0.15mm
Density :
1.4g/cc
Hardness :
90 Shore A
Description

Graphite Composite Thermal Pad For Between Transistors And Heat Sinks

Company profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products introduction


TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.

Feature

> Excellent thermal impedance
> Replaces traditional thermal grease

> High reliability
> Easy to apply to surfaces

Application

> Between transistors and heat sinks

> Between mechanical structures

> Between heat sinks and externalcasings

Typical Properties of TIR®300L series
Product Name TIR®300L Test Method
Colour Black Visual
Reinforcement Carrier Aluminum *****
Thickness range 0.15 mm ASTM D374
Hardness 90 Shore A ASTM D2240
Density 1.4g/cc ASTM D792
Volume Resistivity(ohm-cm) 1*102 ASTM D257
Continuous Use Temperature -60℃~ 180℃ Ziitek Test Method
Thermal Conductivity(W/mK) 2.5 ASTM D5470
Thermal impedance(℃-in2/W)@30psi 0.30 ASTM D5470
Thermal impedance(℃-in2/W)@50psi 0.25 ASTM D5470
180° Peel Strength 1.0N/25mm ASTM D3330(Steel,Immediate)

Standard size:
Sheet: 305 mm*305 mm; Roll: 305 mm*75 m.
TIR300L series can be cut and supplied in various shapes and sizes.

For different thicknesses or sizes, please contact our company.

Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks

Packaging Details & Lead time

1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

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Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks

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Product Detail
Brand Name :
Ziitek
Model Number :
TS-TIR300L
Certification :
RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10USD/pcs
Contact Supplier
Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks
Graphite Composite Thermal Pad for Superior Thermal Conductivity Between Transistors and Heat Sinks

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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