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Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Specifications
Brand Name :
Ziitek
Model Number :
TIF100 2855-10
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Application :
Computer CPU GPU Cooling Gap Pads
Thickness :
0.25-5.0mmT
Specific Gravity :
3.0 g/cc
Dielectric Breakdown Voltage :
>5500 VAC
Thermal conductivity :
2.8W/m-K
Keywords :
Thermal pad
Construction :
Ceramic filled silicone elastomer
Description

Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components.


Features

> Good thermal conductive: 2.8W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications


> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Routers
> Telecommunication hardware

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

Typical Properties of The TIF®100 2855-10 Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 55 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.2 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.8 W/m-K ASTM D5470
2.8 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

FACTORY INFORMATION:

Factory Size

5,000-10,000 square meters

Factory Country/Region

Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Annual Output Value

US$1 Million - US$2.5 Million

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100 2855-10
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads
Low Bleed Thermal Pad Thermal GAP PAD Materials For Computer CPU GPU Cooling Gap Pads

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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