MachineU > China Products > Rubber & Plastics
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Specifications
Brand Name :
Ziitek
Model Number :
TIF700UU
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Thermal conductivity :
10.0W/m-K
Thickness range :
0.75-5.0mmT
Keywords :
Thermal GAP PAD Materials
Application :
AI Servers, Inverters, Telecom Devices
Color :
Gray
Breakdown Voltage（V/mm)） :
≥4000
Fire rating :
UL94 V-0
Dielectric Constant @1MHz :
7.0
Construction :
Ceramic filled silicone elastomer
Description

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

The TIF®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Features:

> Good thermal conductivity: 10.0W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Typical Properties of TIF®700UU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm)

0.030

(0.75)

 0.040~0.200 (1.00~5.00) ASTM D374
Hardness (Shore OO) 30/10 30/10 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥4000 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 10.0 W/m-K ASTM D5470
10.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.030"(0.75 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Send your message to this supplier
Send Now

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Ask Latest Price
Watch Video
Product Detail
Brand Name :
Ziitek
Model Number :
TIF700UU
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Silicone Thermal Pad
MachineU China Products Rubber & Plastics
Contact Supplier
Submit Requirement