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Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Specifications
Brand Name :
Ziitek
Model Number :
TIF200-20-18U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Sample :
Sample free
Fire rating :
94 V0
Application :
Consumer Electronics Cooling
Color :
Yellow/Green
Thermal conductivity :
2.0W/m-K
Dielectric Constant @ 1MHz :
5.0MHz
Breakdown Voltage（V/mm） :
≥8000
Thickness range :
0.010"~0.200"(0.25mm~5.0mm)
Keywords :
Thermal Gap Pads
Description

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads​ For Motherboard Chip

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Ziitek TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits.Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices, new energy vehicles, and portable electronic devices.

Features


> Good thermal conductivity
> Extremely soft, low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Puncture-resistant, tear-resistant, and scratch-resistant performance


Applications


> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

Typical Properties of TIF®200-20-18U Series
Property Value Test method
Color Yellow/Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.25 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 27 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 8000 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ:

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF200-20-18U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
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Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads
Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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