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Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Specifications
Brand Name :
Ziitek
Model Number :
TIF200-10-02ES
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Keywords :
Silicone Thermal Pad
Sample :
Sample free
Fire rating :
94 V0
Color :
Pink/ White
Thermal conductivity :
1.0W/m-K
Dielectric Constant @ 1MHz :
5.0MHz
Dielectric Breakdown Voltage :
>5500 VAC
Thickness range :
0.010"~0.200"(0.25mm~5.0mm)
Application :
Any Heating Element And Radiator
Description

Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Ziitek TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength,effectively preventing circuit short circuits.Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices, new energy vehicles, and portable electronic devices.

Features


> Good thermal conductivity
> Extremely soft, low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Puncture-resistant, tear-resistant, and scratch-resistant performance


Applications


> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

Typical Properties of TIF®200-10-02ES Series
Property Value Test method
Color Pink/White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.8 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 10 Shore 00 10 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 1.0 ASTM D5470
1.0 ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF200-10-02ES
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip
Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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