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Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Specifications
Brand Name :
Ziitek
Model Number :
TIF500-75-11U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Sample :
Sample free
Breakdown Voltage（V/mm） :
≥5500
Thickness range :
0.020"~0.200"(0.50mm~5.0mm)
Keywords :
Silicone Cooling Pad
Dielectric Constant @ 1MHz :
8.0
Fire rating :
94 V0
Color :
Dark Gray
Thermal conductivity :
7.5W/m-K
Application :
PC Laptop
Description

Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIF®500-75-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

> Photovoltaic
> Signal communication
> New energy vehicle

> Motherboard chip
> Radiator
> AI Processors AI Servers

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD

Typical Properties of TIF®500-75-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 50 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥ 5500 ASTM D149
Dielectric Constant 8.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 7.5 ASTM D5470
7.5 ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications
Standard Thickness: 0.020" (0.50 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF500-75-11U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop
Bridging Gaps 7.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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