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Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Specifications
Brand Name :
Ziitek
Model Number :
TIF100-12-66U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Thickness range :
0.010"(0.25mm)~0.200"(5.0mm)
Application :
Laptop Heat Insulation Materials
Thermal conductivity :
1.2W/m-K
Color :
Green
Dielectric Constant :
4.0MHz
Dielectric Breakdown Voltage :
>5500 VAC
Fire rating :
94 V0
Keywords :
Thermal Pad
Description

Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

The TIF®100-12-66U Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features


> Good thermal conductive: 1.2W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications


> LED TV / LED Lit Lamps
> Automotive engine control units
> SAD-DC Power Adapters
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Micro heat pipe thermal solutions
> Memory Modules

> Routers

> Telecommunication hardware

> Mainboard/mother board

Typical Properties of TIF®100-12-66U Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.2 W/m-K ASTM D5470
1.2 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

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Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF100-12-66U
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials
Highly Efficient Thermal Conductivity 1.2W/MK Silicone Thermal Pads For Laptop Heat Insulation Materials

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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