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Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Specifications
Brand Name :
Ziitek
Model Number :
TIF500-40-11U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Dielectric Constant@1MHz :
7.0
Application :
AI Servers
Thermal conductivity :
4.0W/m-K
Sample :
Sample free
Dielectric Breakdown Voltage :
>5500 VAC
Keywords :
Silicone Thermal Pads
Fire rating :
94 V0
Color :
Dark Gray
Thickness range :
0.010inch~0.20inch/(0.25mm~5.0mm)
Description

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF®500-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit , It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features


> Good thermal conductive: 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction

> Good insulation performance
> Electrically isolating
> High durability


Applications


> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

Typical Properties of TIF®500-40-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
4.0 W/m-K ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

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Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF500-40-11U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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