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Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Specifications
MOQ :
1000 pcs
Place of Origin :
China
Thickness :
0.010"(0.25mm)~0.200"(5.0mm)
Thermal conductive :
2.0 W/mK
Density :
2.65g/cm³
Delivery Time :
3-8 work days
Price :
0.1-10 USD/PCS
Application :
Electronic And Industrial Fields
Hardness :
65/45 Shore 00
Model Number :
TIF100-20-10S
Packaging Details :
24*13*12cm carton
Payment Terms :
T/T
Products name :
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Sample :
Free sample
Brand Name :
Ziitek
Supply Ability :
100000pcs/month
Construction :
Ceramic filled silicone elastomer
Color :
Gray
Keywords :
Silicone Thermal Pad
Certification :
UL and RoHs
Description

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields


Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields


Products description

TIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.


Features

>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses

Applications

>Embedded Motherboard
>Industrial visual inspection equipment
>Graphics card cooling module
>Charging pile power module
>Central control screen
>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures

Key attributes


Typical Properties of TIF®100-20-10S Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 4.7 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity(Ohm-meter) ＞1.0X1012 ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 2.0 ASTM D5470
2.0 ISO22007

Product Specifications


Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields


Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Send your message to this supplier
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Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields

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Product Detail
MOQ :
1000 pcs
Place of Origin :
China
Thickness :
0.010"(0.25mm)~0.200"(5.0mm)
Thermal conductive :
2.0 W/mK
Density :
2.65g/cm³
Delivery Time :
3-8 work days
Contact Supplier
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Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields
Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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