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GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
Specifications
Payment Terms :
T/T
Application :
Battery Pack Thermal Management
Model Number :
TIF100-15-11UF
Feature :
Good softness and filling property
MOQ :
1000pcs
Delivery Time :
3-5 work days
Keywords :
GPU Thermal Pad
Price :
0.1-10 USD/PCS
Thermal conductive :
1.5W/mK
Certification :
UL & RoHS
Hardness :
75 Shore 00
Supply Ability :
1000000 pcs/month
Brand Name :
Ziitek
Products name :
AI Server Thermal Pad 2.5W/mK Thermal Management For Servers
Packaging Details :
24*13*12cm cartons
Place of Origin :
China
Thickness range(inch/mm) :
0.010"~0.200"(0.25~5.00mm)
Description
GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
Company Profile

Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. We are a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. With production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam, we ensure efficient delivery and localized services worldwide.

Our product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, serving applications in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company holds IATF16949 and ISO9001 certifications, with products meeting ROHS, REACH and UL specifications.

Product Description

The TIF®100-15-11UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features
  • Good thermal conductivity
  • Good softness and filling property
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Home appliance industry
  • Power module
  • Wearable device
  • Solar photovoltaic panel
  • LED lighting fixtures
  • Routers
  • AI server
  • Medical equipment
  • Unmanned aerial vehicle (UAV)
  • Robot
  • Wireless Charger
Typical Properties of TIF®100-15-11UF Series
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 2.1 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 75 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.9 ASTM D150
Volume Resistivity (Ohm*cm) ＞1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: For quantities of 5000 pieces, estimated time to be negotiated.

Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer with facilities in China and Vietnam.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Why Do AI Servers Need High-Performance Thermal Interface Materials?
AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.
How Do I Choose the Right Thermal Interface Material?
Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.
What Thermal Interface Materials Does ZIITEK Offer?
ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.

For custom specifications, pricing, or technical support, please contact our sales team for personalized assistance.

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GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

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Product Detail
Payment Terms :
T/T
Application :
Battery Pack Thermal Management
Model Number :
TIF100-15-11UF
Feature :
Good softness and filling property
MOQ :
1000pcs
Delivery Time :
3-5 work days
Contact Supplier
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GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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