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Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Specifications
Model Number :
TIF100-30-15S
Application :
Electronic Components
Packaging Details :
24*13*12cm cartons
Payment Terms :
T/T
Thermal conductive :
5.0W/mK
Place of Origin :
China
Hardness :
45/65 Shore 00
MOQ :
1000pcs
Delivery Time :
3-5 work days
Thickness range(inch/mm) :
0.010"~0.200"(0.25~5.00mm)
Price :
0.1-10 USD/PCS
Keywords :
Thermal Gap Filler Pads
Certification :
UL & RoHS
Feature :
Good softness and fillability
Supply Ability :
1000000 pcs/month
Density(g/cm³） :
3.0
Brand Name :
Ziitek
Products name :
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Description
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Company Profile

Dongguan Ziitek Electronic Material and Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Product Description

TIF ®100-30-15S Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features
  • High thermal conductivity
  • Good softness and fillability
  • Self-adhesive without the need for additional surface adhesives
  • Good insulation performance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
Typical Properties of TIF ®100-30-15S Series
Property Value Test method
Color Purple Visual
Construction Ceramic filled silicone elastomer -
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 6.0 ASTM D150
Volume Resistivity(Ohm-cm) ＞1.0X10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"X16" (406 mm×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Packaging Details & Lead Time

Packaging of thermal pad:

  • With PET film or foam for protection
  • Use Paper Card To Separate Each Layer
  • Export carton inside and outside
  • Meet with customers' requirement-customized

Lead Time: Quantity: 5000 pieces - Estimated Time: To be negotiated

Why Choose Us?
  • Our value message is "Do it right the First time, total quality control"
  • Our core competencies is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement Business Secret Contract
  • Free sample offer
  • Quality assurance contract

For custom specifications, pricing, or additional information, please contact our technical sales team.

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Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components

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Product Detail
Model Number :
TIF100-30-15S
Application :
Electronic Components
Packaging Details :
24*13*12cm cartons
Payment Terms :
T/T
Thermal conductive :
5.0W/mK
Place of Origin :
China
Contact Supplier
video
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components
Thermal Gap Filler Pads That Improve Heat Transfer Efficiency And Extend Service Life Of High Precision Electronic Components

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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