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Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Specifications
Model Number :
TIF100-15-11F Series
Thinkness range :
0.010"(0.25mm)~0.200" (5.0mm)
Payment Terms :
T/T
Thermal Conductivity :
1.5W/mK
Place of Origin :
China
Sample :
Sample Avaliable
Packaging Details :
24*13*12cm cartons
MOQ :
1000pcs
Delivery Time :
3-5 work days
Flam rating :
94 V0
Keywords :
Thermal Gap Filler
Price :
0.1-10 USD/PCS
Hardness :
65/60 Shore 00
Certification :
RoHS and UL recognized
Supply Ability :
1000000 pcs/month
Color :
Dark gray
Brand Name :
Ziitek
Products name :
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Description
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.
Key Features
  • Excellent thermal conductivity: 1.5 W/mK
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • Available in various thicknesses
  • Broad range of hardnesses available
Applications
Cooling components to chassis or frame
High speed mass storage drives
LED TV and LED-lit lamps
RDRAM memory modules
Micro heat pipe thermal solutions
Display cards and motherboards
Notebook computers and power supplies
Telecommunication hardware
Memory modules
Home appliance industry
Power module
Wearable devices
Technical Specifications of TIF®100-15-11F Series
Property Value Test Method
Color Dark Gray Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 2.2 ASTM D792
Thickness Range 0.010"~0.020" | 0.030"~0.200"
0.25~0.50mm | 0.75~5.00mm		 ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity ＞1.0*10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470 / ISO22007
Product Dimensions
Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with 0.010" (0.25 mm) increments
Standard Size: 16" * 16" (406 mm * 406 mm)
Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Packaging & Lead Time
Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging, customizable to customer requirements.
Lead Time: For quantities of 5000 pieces, delivery time is negotiable.
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer based in China.
Do you accept custom orders?
Yes, we welcome custom orders. We can customize dimensions, shapes, colors, and apply adhesive coatings or fiberglass reinforcement as required. Please provide drawings or detailed specifications.
How much do the pads cost?
Pricing depends on size, thickness, quantity, and specific requirements such as adhesive applications. Please provide these details for an exact quote.
Our Services
  • 12-hour online service with fast inquiry response
  • Business hours: 8:00 AM - 5:30 PM, Monday to Saturday (UTC+8)
  • Experienced English-speaking support staff
  • Standard export packaging or customized marking
  • Free samples available
  • Comprehensive after-sales support and problem resolution
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Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

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Product Detail
Model Number :
TIF100-15-11F Series
Thinkness range :
0.010"(0.25mm)~0.200" (5.0mm)
Payment Terms :
T/T
Thermal Conductivity :
1.5W/mK
Place of Origin :
China
Sample :
Sample Avaliable
Contact Supplier
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Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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