Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems
TIF®100-15-01E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Key Features
- Good thermal conductivity
- Moldability for complex parts
- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- Available in various thicknesses
Applications
- CPU
- Display card
- Mainboard/mother board
- Notebook
- Power supply
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- Automotive electronics
- Set top boxes
- Audio and video components
Technical Specifications of TIF®100-15-01E
| Property |
Value |
Test Method |
| Color |
Black |
Visual |
| Construction & Composition |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
2.3 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.0 |
ASTM D374 |
| Hardness (Shore 00) |
65 | 35 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
- |
| Breakdown Voltage (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @ 1MHz |
4.7 |
ASTM D150 |
| Volume Resistivity |
>1.0×10¹² Ohm-meter |
ASTM D257 |
| Flame Rating |
V-0 |
UL 94 (E331100) |
| Thermal Conductivity |
1.5 W/m-K |
ASTM D5470, ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging & Lead Time
Packaging Details:
- PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized to meet customer requirements
Lead Time: Quantity: 5000 pieces - To be negotiated
Frequently Asked Questions
- Q: Are you a trading company or manufacturer?
A: We are manufacturer in China.
- Q: What thermal conductivity test method was used?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
- Q: Is GAP PAD offered with an adhesive?
A: Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
- Q: How do I place an order?
A: Click the "Send messages" button, fill out the form with your questions and purchase requests, and we will reply as soon as possible via email or online.
About Ziitek
Dongguan Ziitek Electronic Material and Technology Co., Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!