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China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
Specifications
Brand Name :
Ziitek
Model Number :
TIF140-01U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
Thickness :
0.5-5.0mmT(0.020"~0.20")
Specific Gravity :
2.2 g/cc
Dielectric Breakdown Voltage :
＞5500VAC
Thermal conductivity :
1.5W/m-K
Keywords :
Thermal Gap Filler
Dielectric Constant@1MHz :
3.5
Color :
Black
Application :
AI Servers, Inverters, Cooling components to the chassis of frame
Description

China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Products description


The TIF140-01U Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

TIF100-01U Series Datasheet-(E)-REV02.pdf


Features


> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance


Applications


> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Routers
> Telecommunication hardware

> Cooling components to the chassis of frame

Typical Properties of TIF140-01U Series
Color
 Black
Visual
Construction & Compostion
Ceramic filled silicone elastomer

***
Specific Gravity
2.2 g/cc

ASTM D297
Thickness range 0.020"-0.200"(0.5mm~5.0mm)
ASTM C351
Hardness
27 Shore 00
ASTM 2240
Dielectric Breakdown Voltage
 >5500 VAC
ASTM D412
Continuos Use Temp
-40 to 160℃
*****
Outgassing(TML)
0.35%
ASTM E595
Dielectric Constant
3.5 MHz
ASTM D150

Volume Resistivity
1.0X1012 Ohm-meter
ASTM D257
Fire rating
94 V0
UL E331100
Thermal conductivity
1.5W/m-K
ASTM D5470

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: Do you offer free samples ?

A: Yes, we are offer free sample.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Product tags

thermaltake micro atx case

,

heat shrink supplier

,

thermal paste laptop
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China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF140-01U Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook
China Company Supplied Ultra Soft 27 Shore 00 Thermal Gap Filler 1.5 W/M-K Outstanding Thermal Performance For Notebook

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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