Ultra Soft Silicone Thermal Pad Series For AI Processors AI Servers Radiator Cooling

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

The TIF140-02F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability.It can reliably fillinterfacegaps,transfer heat,andoffer mechanical supportfor stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features

> Available in varies thicknesses 1.5W/mK
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.