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1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 
Specifications
Brand Name :
Ziitek
Model Number :
TIF1100-02F Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Products name :
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules
Construction & Compostion :
Ceramic filled silicone elastomer
Density :
2.3 g/cc
Hardness :
60 Shore 00
Continuous Use temp(℃） :
-40~160℃
Thermal conductivity :
1.5W/m-K
Keywords :
Silicone Thermal Pad
Color :
Gray
Application :
Laptop/Desktop/GPU/Computer/Memory Modules
Description

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Products description

The TIF®1100-02F Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features


>Good thermal conductivity: 1.5W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness

>High tack surface reduces contact resistance
>RoHS compliant
>UL recognized

Application


>Cooling components to the chassis of frame
>Set Top Box
>Car Battery & Power Supply
>Charging Pile
>LED TV/Lighting
>Graphics Card Thermal Module

>CPU
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules

Typical Properties of TIF®1100-02F Series
Color Gray Visual
Construction Ceramic filled silicone elastomer ******
Thickness Range(inch/mm) 0.020~0.20inch(0.5mm~5.0mm)　 ASTM D374
Density(g/cc) 2.3 g/cc ASTM D297
Hardness 60 Shore 00 ASTM 2240
Recommended Operating Temperature(℃) -40 to 160℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @ 1MHz 4.0 ASTM D150
Volume Resistivity ≥1.0X1012Ohm-meter ASTM D257
Flame rating 94 V-0 UL E331100
Thermal conductivity 1.5W/m-K ASTM D5470

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

Product tags

laptop gpu thermal pad

,

laptop heatsink pad

,

heatsink cooling thermal conductive silicone pad
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1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1100-02F Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 
1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules 

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
7 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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