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Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 
Specifications
Density :
2.3 g/cm³
Hardness(Shore OO) :
60/65
Brand Name :
Ziitek
Model Number :
TIF180-02F Series
Certification :
UL & RoHS
Place of Origin :
China
MOQ :
1000pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
1000000 pcs/month
Delivery Time :
3-5 work days
Packaging Details :
24*13*12cm cartons
Thermal conductivity :
1.5W/m-K
Keywords :
Thermal Gap Pad
Flame rating :
94 V0
Features :
Good softness and fillability
Application :
Memory Modules
Products name :
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules
Description

Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules


Company Profile


Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:


Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel


All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL


Products description


The TIF®180-02F Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features


> Good thermal conductive: 1.5W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability


Applications


> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

> Motherboard chip
> Radiator
> AI Processors AI Servers


Typical Properties of TIF®100-02F Series
Property Value Test method
Color Gray White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5W/m-K ASTM D5470
1.5W/m-K ISO22007


Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 

Why Choose us ?


1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

thermal conductive pad 2mm

,

heatsink cooling thermal conductive silicone pad

,

thermal conductive silicone pad
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Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 

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Product Detail
Density :
2.3 g/cm³
Hardness(Shore OO) :
60/65
Brand Name :
Ziitek
Model Number :
TIF180-02F Series
Certification :
UL & RoHS
Place of Origin :
China
Contact Supplier
video
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 
Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules 

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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