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Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Specifications
Brand Name :
Ziitek
Model Number :
TIF1200-30-02US
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
25*14*13cm carton
Prodcuts name :
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
keyword :
Thermal Gap Pad
Construction & Compostion :
Ceramic filled silicone elastomer
Thickness :
5.0mmT
Hardness :
20/65 Shore 00
Thermal conductivity :
3.0 W/m-K
Dielectric constant@1MHz :
7.0 MHz
Application :
Display Card,CPU,GPU
Description

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF®1200-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive:3.0W/mK
> Thickness:5.0mmT
> Hardness:20 Shore 00
> Colour: gray

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Applications

> Automotive engine control units

> Telecommunication hardware

> Handheld portable electronics

> Semiconductor automated test equipment (ATE)

> CPU

> display card

Typical Properties of TIF®100-30-02US Series
Property Value Test method
Color Gray white Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Product tags

thermal conductive pad 2mm

,

heatsink cooling thermal conductive silicone pad

,

thermal conductive silicone pad
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Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1200-30-02US
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
30000000-35700000
Employee Number :
600~700
Certification Level :
Verified Supplier
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