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Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Specifications
Brand Name :
Ziitek
Model Number :
TIF1160-30-05US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Payment Terms :
T/T
Supply Ability :
100000pcs/month
Delivery Time :
3-8 work days
Packaging Details :
24*13*12cm cartons
Products Name :
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Certifications :
ISO14001: 2004
Thermalconductivity :
3.0 W/mK
Keyword :
Silicone Thermal Pad
Application :
5G Base Station & Infrastructure
Color :
Blue
Density :
3.0g/cm³
Construction :
Ceramic filled silicone elastomer
Description

Dielectric constant 4.0 MHz high cost-effective silicone pads for CD-Rom

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF®1160-30-05US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress.This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications

> Automotive electronics

> Set top boxes

> Audio and video components

> IT infrastructure

> GPS navigation and other portable devices

> CD-Rom, DVD-Rom cooling

> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

Typical Properties of TIF®100-30-05US Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 50 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

Product Specification

Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us

Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product tags

silicon dielectric constant

,

thermoelectric chip

,

thermoelectric cooling chip
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Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure

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Product Detail
Brand Name :
Ziitek
Model Number :
TIF1160-30-05US thermal pad
Certification :
UL
Place of Origin :
China
MOQ :
1000 pcs
Price :
0.1-10 USD/PCS
Contact Supplier
video
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure
Fiberglass Reinforced Dielectric Constant 7.0MHz CPU Silicone Thermal Pad For 5G Base Station & Infrastructure

Dongguan Ziitek Electronical Material and Technology Ltd.

Verified Supplier
8 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer, Seller
Main Products :
Silicone Thermal Pad, Heat Sink Thermal Pad, CPU Thermal Pad
Total Annual :
1000000-16000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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